Channel-bonding CMOS transceiver for 100 Gbps wireless point-to-point links - Département Systèmes et Circuits Intégrés Numériques
Article Dans Une Revue EURASIP Journal on Wireless Communications and Networking Année : 2020

Channel-bonding CMOS transceiver for 100 Gbps wireless point-to-point links

Résumé

5G systems and networks are expected to provide unprecedented data-rate to final users and services, in combination with increased coverage and density. The traffic generated at the edges of the network should be hauled through high capacity data-conveyors. Extremely high data-rate links able to provide optical-fiber like performance in the order of 100 Gbps are required to reduce the cost and increase the flexibility of the network infrastructure deployment. This paper presents a full transceiver architecture based on a channel-bonding radio-frequency front-end operating at millimeter-wave frequencies and digital baseband processing units able to provide such data-rates with a feasible implementation in low-cost CMOS technologies. The baseband section of the receiver includes digital compensation algorithms that allow to cope with some of the radio front-end impairments. The main functionalities of the proposed transceiver architecture are validated in hardware.
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cea-04587460 , version 1 (27-09-2024)

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José Luis Gonzalez-Jimenez, Cédric Dehos, Nicolas Cassiau, Alexandre Siligaris, Antonio Clemente, et al.. Channel-bonding CMOS transceiver for 100 Gbps wireless point-to-point links. EURASIP Journal on Wireless Communications and Networking, 2020, 2020, pp.117. ⟨10.1186/s13638-020-01741-1⟩. ⟨cea-04587460⟩
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